2D Electronics inspection & CT
x|series Performance Line
Harness the power of advanced microfocus and nanofocus X-ray technology for the most reliable solder joint inspections. As quantity and quality demands increase, and new complex assembly methods are introduced, standard inspection processes are no longer enough to keep pace. Our x|series performance line is designed to reveal even the smallest defects in BGA packages, electronics, PCBAs, semiconductors, and other assemblies—allowing you to make smarter production decisions with confidence.
What's inside my USB flash device?